NXP has announced the i.MX 93W, its first integrated wireless application processor that combines a dual-core Cortex-A55 CPU running at up to 1.7 GHz with an iW610 tri-radio supporting Wi-Fi 6, Bluetooth LE, and 802.15.4 connectivity. The 14.2 x 12 mm (0.56 x 0.47 inches) System-in-Package replaces up to 60 discrete components by integrating all external radio components needed for wireless connectivity, reducing PCB area and simplifying regulatory approval.
The SiP includes a 250 MHz Cortex-M33 core for real-time control, an Arm Ethos-U65 microNPU for AI acceleration, and a 2D graphics accelerator. Connectivity options include dual Gigabit Ethernet ports with time-sensitive networking support, two USB 2.0 interfaces, CAN FD, and display outputs via MIPI DSI up to 1080p60, LVDS up to 720p60, and 24-bit parallel RGB. The integrated iW610 tri-radio delivers 114.7 Mbps peak throughput over Wi-Fi 6 with support for WPA3 Enterprise security and Matter over Wi-Fi, plus Bluetooth LE with up to +15 dBm transmit power and switchable 802.15.4 for Zigbee and Matter over Thread.
NXP says the chip supports Linux on the Cortex-A55 cores and FreeRTOS on the Cortex-M33 core, with target applications including smart home hubs, medical sensors, and energy grid devices. The integrated wireless approach is relatively uncommon in application processors, with the Allwinner V821 RISC-V chip for cameras and the 2016-era Snapdragon 410E being among the few comparable examples.
The i.MX 93W was unveiled at Embedded World 2026 with availability expected in early 2027. Additional details are available on the NXP product page and the company blog.
