Microchip has launched the SAM9X75, an automotive-qualified System-in-Package built around the legacy ARM926EJ-S core, six years after introducing the SAM9X60. The new chip runs at 800 MHz (up from the previous generation's 400-600 MHz) and integrates DDR2 or DDR3L memory directly on-package, with variants offering 512 MB DDR2 (SAM9X75D5M), 1 Gbit DDR3L (SAM9X75D1G), or 2 Gbit DDR3L (SAM9X75D2G). Despite using a processor architecture from the mid-2000s, Microchip targets automotive and e-mobility HMI applications where deterministic behavior and fast boot times matter more than raw performance.
The SAM9X75 includes display capabilities through 4-lane MIPI DSI, LVDS, and 24-bit parallel RGB interfaces supporting panels up to 10.1 inches (25.7 cm) at XGA resolution (1024×768), along with a 2D graphics controller. Camera support comes via a 4-lane MIPI CSI-2 interface and Image Sensor Controller that handles sensors up to 5 MP in raw Bayer, YCbCr, monochrome, and JPEG formats. Networking arrives through Gigabit Ethernet with Time-Sensitive Networking (TSN) support, three high-speed USB host ports, one USB device port, and two CAN-FD interfaces. Security features include AES (128/192/256-bit), SHA/HMAC, TDES, a True Random Number Generator, and Physical Unclonable Function with secure boot capabilities.
Microchip positions this as a hybrid MCU rather than a traditional microprocessor because it's designed for bare-metal or RTOS development using MPLAB X IDE and the MPLAB Harmony v3 framework. The company claims millisecond boot times compared to Linux-based MPUs, making it suitable for applications requiring immediate response. Developers can use FreeRTOS, Eclipse ThreadX, or bare C programming, with graphics development supported through Microchip Graphics Suite, LVGL, or Embedded Wizard. For those who prefer Linux, the SAM9X75 has mainline kernel support through Microchip's Linux4SAM project, with demonstration images available based on Linux kernel 6.12.x (including long-term support updates), U-Boot 2025.07, and Yocto Project 5.0.13 (Scarthgap) or Buildroot 2025.02.5 LTS, offering flexibility between real-time bare-metal performance and feature-rich Linux environments. The chip comes in a 243-ball TFBGA package (16×16 mm, 0.8 mm pitch) rated for automotive temperatures from negative 40°C to positive 105°C (negative 40°F to 221°F) with AEC-Q100 Grade 2 qualification.
Two development boards are available, the SAM9X75 Early Access Curiosity Wireless Kit and SAM9X75 Curiosity LAN Kit, both based on the SAM9X75D2G variant with 2 Gbit DDR3L. The boards feature 4 Gbit SLC NAND, 64 Mbit QSPI NOR flash, microSD slot, and a 40-pin Raspberry Pi-compatible GPIO header. The Wireless Kit adds Bluetooth (RNBD451) and Wi-Fi via M.2 module, while the LAN Kit focuses on Ethernet connectivity through a LAN8840 daughter card. Microchip also offers a SAM9X75 System-on-Module measuring 35×30 mm (1.4×1.2 inches) with 174 pins, including Gigabit Ethernet PHY and power management.
The SAM9X75D5M SiP is available now starting at $10 (€9) for quantities below 25 units, dropping to $9 (€8) for orders above 500 units, while the SAM9X75D1G and SAM9X75D2G variants are currently sampling. The System-on-Module costs approximately $24 (€22) in low quantities and $20 (€18) in higher volumes. Both development kits are priced at $169 (€155).
