NXP has unveiled the i.MX 937, a new applications processor targeting human-machine interface (HMI) and edge AI applications. The chip features four Arm Cortex-A55 cores running at 1.4 GHz, a dedicated 667 MHz Cortex-M7 for real-time tasks, and a low-power Cortex-M33 for system management. It slots between NXP's entry-level i.MX 93 and higher-end i.MX 952 processors while maintaining pin-to-pin compatibility with the latter.
The i.MX 937 integrates an Arm Mali G310 3D GPU, a video processing unit capable of 1080p60 H.265/H.264 decoding and H.264 encoding, and a 2 eTOPS eIQ Neutron neural processing unit for machine learning workloads. Memory support includes LPDDR5 up to 4,500 MT/s or LPDDR4x up to 3,733 MT/s, both with inline ECC. Display connectivity covers 4-lane MIPI DSI and dual 4-lane or single 8-lane LVDS interfaces supporting 1080p60 output, plus a 4-lane MIPI CSI camera interface.
NXP designed the processor to simplify product scaling across its lineup. The i.MX 937 shares a unified development ecosystem with the i.MX 95 and i.MX 952 families, including the same board support package (BSP), security architecture, and boot structure. Two package options are available: a 15 x 15 mm (0.59 x 0.59 inches) FCBGA compatible with i.MX 952, and a 19 x 19 mm (0.75 x 0.75 inches) version compatible with both i.MX 952 and i.MX 95 designs. The chip supports Linux and Android, operates across consumer (0°C to 90°C), industrial (negative 40°C to 105°C), extended industrial (negative 40°C to 125°C), and automotive (negative 40°C to 125°C) temperature ranges.
NXP plans to release an FRDM i.MX 937 development board in late 2026, with the processor itself becoming available in Q1 2027. Additional technical details are available on NXP's product page and announcement blog post.
