Designs Snapdragon X processors for Windows-on-ARM laptops and system-on-chip solutions for embedded Linux devices.
Firefly's fanless AIBOX-9075 runs Llama, Qwen, and DeepSeek-R1 locally on a 200-TOPS Qualcomm IQ-9075, with 36GB ECC RAM and Ubuntu plus Yocto on the Qualcomm Linux stack.
Radxa unveiled the Snapdragon 8cx Gen 3-based Dragon Q8B and Dragonwing QCS6690 Q5E SBCs, plus DragonStation and DragonBay NAS systems, as part of a 22-product Qualcomm roadmap for 2026.
Qualcomm's new Snapdragon C SoC targets $300 Arm Windows laptops using older Kryo cores, with Acer, HP, and Lenovo models shipping later in 2026.
Qualcomm's $13 QCC74xM evaluation kits pack Wi-Fi 6, Bluetooth 5.4, and Thread/Zigbee around a 325 MHz RISC-V core that is essentially a rebadged Bouffalo Lab BL618.
The Asus Zenbook A16 debuts Qualcomm's 18-core Snapdragon X2 Elite Extreme, which early benchmarks show outpacing Apple's M5 in multi-core tasks inside a 1.3 kg chassis with a 16-inch OLED display.
Qualcomm's new wearable chip brings on-device AI with 12 TOPS performance and support for 2 billion parameter models, plus 5x faster CPU and 7x faster GPU than its predecessor.
Qualcomm's FastConnect 8800 and Dragonwing platforms bring Wi-Fi 8 (802.11bn) to smartphones and routers with 4x4 radios, peak speeds up to 33 Gbps, and features designed for dense IoT deployments.
OnLogic's Factor 101 packs Qualcomm's QCS6490 SoC with 12 TOPS AI performance into a fanless industrial PC measuring just 15.7 x 9.4 x 7.1 cm.
Advantech's SOM-6820 puts Qualcomm's 12-core Snapdragon X Elite and 45 TOPS NPU into a standard COM Express form factor, with Linux kernel support now in progress.
Qualcomm's newest flagship mobile chip benchmarks itself against 2023's Snapdragon 8 Gen 3, conveniently skipping comparisons to last year's Elite model in a curious marketing move.