Quectel's latest smart module squeezes a Rockchip RV1126B quad-core Cortex-A53 processor and a 3 TOPS NPU into a 40 x 40 mm (1.6 x 1.6 in) LCC+LGA package. The SE200ZC-AP ships with a Debian image running Linux kernel 6.1, and its NPU handles INT4, INT8, INT16, and FP16 inference across TensorFlow, ONNX, PyTorch, and Caffe models, making it a compact platform for edge AI camera applications.
The module's standout feature is multi-camera support: two 4-lane MIPI CSI interfaces and one DVP interface allow up to five 12MP cameras simultaneously. A built-in 12MP ISP and 8MP AI-ISP handle image processing, while the video pipeline encodes H.265/H.264 at up to 3840x2160 at 45 FPS and decodes at 30 FPS. Memory options range from 1GB to 4GB of LPDDR4x paired with 64GB eMMC, and connectivity spans Gigabit Ethernet, USB 3.0, two CAN FD buses, up to eight UARTs, and 115 GPIOs. Both commercial (-25°C to +75°C / -13°F to 167°F) and industrial (-35°C to +80°C / -31°F to 176°F) temperature grades are available.
The RV1126B has been gaining traction in the embedded Linux world. Mainline kernel support continues to expand, with pinctrl and RMIO driver patches landing in 2026, and the SoC already powers products like the Luckfox Aura single-board computer and Forlinx's FCU3101 fanless edge AI system. Quectel's module adds another option for developers who want a drop-in system-on-module rather than a full SBC, with optional expansion through external Quectel LTE, Wi-Fi 6, and GNSS modules.
The SE200ZC-AP is expected to be available for customer sampling soon, though Quectel has not announced pricing or a release date for its planned evaluation board.
