Telink Semiconductor has launched the TL322x wireless MCU family, starting with the TL3228, a dual-core RISC-V chip built for smart home devices, asset tracking, and gaming accessories. The chip features a 192 MHz Andes D25F RISC-V core with FPU alongside an Andes N22 RISC-V core, paired with 384 KB of SRAM and 2.5 MB of NVM storage. It supports Bluetooth 6.0 with Channel Sounding, AoA/AoD location services, and LE Audio, plus 802.15.4 radio for Zigbee, Thread, and Matter protocols.
The TL3228 stands out with its support for Telink's proprietary HDT (High Data Throughput) technology, which pushes data rates up to 6 Mbps with ultra-low latency. The chip handles up to four central and four peripheral Bluetooth LE connections simultaneously, with transmit power reaching 10 dBm and receive sensitivity down to -103 dBm for 802.15.4. Connectivity options include USB High Speed, CAN-FD, LIN, and extensive peripheral support with up to 64 GPIO pins, seven SPI interfaces, and dual I2C/I3C controllers.
Power efficiency runs deep with 0.7 µA in deep sleep mode without SRAM retention, 3.8 mA in receive mode, and 4.8 mA in transmit mode at 0 dBm. The chip ships in four package options ranging from QFN40 to WLCSP59, operating across a voltage range of 1.7 to 5.5V. Security features include secure boot, firmware encryption, PKE, TRNG, and hardware cryptography acceleration.
Developers can access Bluetooth LE Multi Connection and Platform SDKs on GitHub, along with the Telink IoT Studio IDE for Windows and Linux. Telink offers two development boards: the open-source TL322X EV board for chip verification and the AIOT-DK1 platform with three MikroBUS sockets for Click expansion modules. The AIOT-DK1 development kit costs $70 (€64).
