Silex Technology and NXP have released the SX-SDMAX6E, a compact wireless module built around NXP's IW623 tri-band Wi-Fi 6E SoC. The module comes in two form factors: a 44-pin LGA package measuring 17 × 18 × 2.65 mm and an M.2 2230 Key-E card. Both versions support 2.4 GHz, 5 GHz, and 6 GHz bands with 1×1 or 2×2 MIMO, along with Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO 3.0.
The SX-SDMAX6E operates from a 3.3V supply with 1.8V support on the LGA version and handles an industrial temperature range of -40°C to +85°C (also -40°F to +185°F). The module supports fast roaming through 802.11k/v/r and offers channel bandwidths up to 80 MHz across all three bands. Silex provides optimized driver software for NXP's i.MX9x platform and targets mission-critical applications like factory automation, medical imaging, patient monitoring, and real-time control systems where low latency and stable connectivity matter.
The module is backed by NXP's 10 to 15 year product longevity program, with Silex committing to long-term availability by storing components to continue manufacturing even after end-of-life. The SX-SDMAX6E and its development board are scheduled for release in spring 2026. Datasheets for both the LGA and M.2 versions are available in Japanese on Silex's product page.
