Lenovo has unveiled a new lineup of ThinkEdge devices for edge AI applications, headlined by the ThinkEdge SE60n Gen 2, a fanless embedded computer powered by Intel's Arrow Lake Core Ultra processors delivering up to 97 TOPS of AI performance. The system can be configured with up to an Intel Core Ultra 7 265H featuring a 16-core CPU (6P+8E+2LPE cores at up to 5.30 GHz), an 8-core Arc 140T GPU (75 TOPS), and a 13 TOPS NPU, combining for the total 97 TOPS figure.
The SE60n Gen 2 supports up to 64GB of DDR5-5600 memory via dual SODIMM slots, dual M.2 storage (one PCIe Gen5 x4 NVMe up to 2TB and one SATA up to 1TB), and extensive I/O including dual 2.5GbE ports, WiFi 6E, six USB ports, two RS232/422/485 serial ports, and triple video outputs (two HDMI 2.1 and one DisplayPort). The system measures 24.0 cm (9.4 inches) wide by 15.0 cm (5.9 inches) deep by 5.9 cm (2.3 inches) tall without expansion modules and weighs 2.3 kg (5.1 lbs), with an optional 80-pin Intelligent Expansion Technology module adding networking, USB, or serial port expansion.
Designed for industrial edge environments, the fanless system operates across a temperature range of negative 20°C (negative 4°F) to 60°C (140°F) and accepts 12V to 36V DC input via a terminal block connector. It ships with support for Windows 11 IoT Enterprise LTSC 2024, Ubuntu Core 24.04, and Ubuntu Server 24.04, along with security features including discrete TPM 2.0, Boot Guard, and optional Intel vPro. The system meets MIL-STD-810H and IP50 certifications for durability.
The ThinkEdge SE60n Gen 2 will be available starting in 2026-04, with other new ThinkEdge devices (the SE30n Gen 2, SE50a All-in-One PC, and SE10n Gen 2 gateway) launching between April and July 2026. Pricing has not been announced.
