Seeed Studio has released a new developer kit pairing NVIDIA's Jetson AGX Orin modules with eight GMSL2 camera interfaces, targeting robotics, autonomous vehicles, and edge AI applications that require multiple high-speed camera inputs. The reComputer Jetson AGX Orin Developer Kit GMSL Bundle combines the company's reComputer Mini J501 carrier board with a daughterboard featuring two FAKRA connectors and MAX96712 deserializers for the camera connections.
The kit supports either the Jetson AGX Orin 32GB or 64GB modules, offering up to 275 TOPS of AI performance with the higher-end option. The 64GB variant features a 12-core Arm Cortex-A78AE processor, 2048 CUDA cores, and 64 Tensor cores running at 1.3 GHz. Beyond the camera interfaces, the carrier board includes 10GbE and Gigabit Ethernet ports, HDMI 2.1 output, two USB 3.2 ports, CAN Bus, RS485, and comes pre-installed with a 128GB NVMe SSD and WiFi 5/Bluetooth 5.0 module. The compact system measures just 11 x 11 x 3.8 cm (4.3 x 4.3 x 1.5 inches) and weighs 90 grams (3.2 oz), operating between -10°C to 60°C (14°F to 140°F).
Supported cameras include several Sensing models with resolutions up to 4K and the Orbbec Gemini 335Lg 3D camera, all compatible with JetPack 6.2 and later. Documentation and setup instructions are available on the Seeed Studio wiki. The complete bundle starts at $1,445 (€1,330) with the 32GB module or $2,145 (€1,975) for the 64GB version, including heatsink, power adapter, and wireless antenna. The carrier board with GMSL extension is also available separately for $360 (€330) for those who already own a Jetson AGX Orin module.
