ADLINK has built its latest embedded development kit around the SGeT Open Standard Module specification, a solder-down system-on-module standard designed to eliminate board-to-board connectors in production hardware. The I-Pi OSM IMX95 pairs ADLINK's 45 x 45 mm (1.8 x 1.8 in) OSM-IMX95 compute module with a 165 x 115 mm (6.5 x 4.5 in) carrier board, shipping with a Yocto Linux BSP and full source code on GitHub.
At the heart of the module sits NXP's i.MX95, a heterogeneous processor that bundles six Arm Cortex-A55 application cores alongside a Cortex-M7 and Cortex-M33 for real-time workloads. An eIQ Neutron N3 NPU delivers up to 2 TOPS for on-device inference, complemented by an Arm Mali-G310 GPU, an image signal processor, and a video processing unit. Security is handled through Arm TrustZone and NXP's EdgeLock secure enclave. The dev kit ships with 4 GB of LPDDR4 and 32 GB of eMMC, though the module family supports configurations up to 8 GB of memory and 256 GB of storage.
The carrier board packs dual Gigabit Ethernet ports with Time-Sensitive Networking support, two USB 3.0 and two USB 2.0 host ports, a USB 2.0 OTG interface, and an M.2 M-key slot for PCIe Gen 3 expansion. Display output spans HDMI, dual-channel LVDS, and four-lane MIPI-DSI, with a four-lane MIPI-CSI connector for camera input. Expansion headers expose five UART, three SPI, two I2C, 14 GPIO, and two CAN FD interfaces. The board operates at 0°C to 60°C (32°F to 140°F) by default, with an optional rugged configuration rated for -40°C to 85°C (-40°F to 185°F), backed by shock and vibration testing to IEC 60068 and MIL-STD-202 standards.
Software support ships as a Yocto BSP based on the Scarthgap release running Linux kernel 6.6 with Wayland, maintained through ADLINK's meta-adlink-nxp Yocto layer, which covers the company's full lineup of NXP i.MX based boards and modules. The layer sees module-specific upkeep: a pull request merged in October 2026 upgraded the EdgeLock Enclave firmware to version 2.0.6 specifically to resolve an OSM-IMX95 boot issue. NXP's broader i.MX Linux ecosystem has continued to mature, with its BSP reaching release LF6.18.37 (Linux kernel 6.18) in September 2026. Upstream mainline support for the i.MX95 platform itself is still a work in progress: a patch series adding remote processor support for the Cortex-M7 and M33 cores reached its sixth revision in January 2026, while a proposal for the platform's display controller driver architecture remained an unresolved RFC as of mid-2026. Foundries.io Linux microPlatform support is also available for the underlying module, providing an OTA-capable alternative for fleet management. ADLINK is backing the module family with a 15-year availability commitment.
The I-Pi OSM IMX95 development kit is priced at $595 (€550) and includes the carrier board with soldered module, a 19V power adapter, and a USB Type-C cable. It is currently listed as sold out, with an estimated lead time of six to eight weeks for US and EU orders.
