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ADLINK AMD Ryzen Embedded V3000 COM Express Type 7 Module: Supports 64GB DDR5 Memory

ADLINK has introduced the Express VR7, a COM Express Basic size Type 7 computer-on-module that is powered by the eight-core AMD Ryzen Embedded V3000 processor. The module features two 10GbE interfaces, fourteen PCIe Gen 4 lanes, and optional support for an “extreme temperature range” between -40°C and 85°C.

The ADLINK Express VR7 supports up to 64GB dual-channel DDR5 SO-DIMM memory (ECC/non-ECC). It is designed for headless embedded applications such as edge networking equipment, 5G infrastructure at the edge, video storage analytics, intelligent surveillance, industrial automation and control, and rugged edge servers.


  • SoC: AMD Embedded Ryzen V3000
    • Ryzen V3C48 8-core/16-thread processor @ 3.3/3.8GHz; TDP: 45W
    • Ryzen V3C44 4-core/8-thread processor @ 3.5/3.8GHz; TDP: 45W
    • Ryzen V3C18I 8-core/16-thread processor 1.9/3.8GHz; TDP: 15W (useful in the extreme temperature range)
    • Ryzen V3C16 6-core/12-thread processor 2.0/3.8GHz; TDP: 15W
    • Ryzen V3C14 4-core/8-thread processor 2.3/3.8GHz; TDP: 15W
  • System Memory: Up to 64GB (2x 32GB) dual-channel ECC/non-ECC DDR5 memory up to 4800 MT/s via two SODIMM sockets
  • On-module chips:
    • Embedded BIOS: AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS (dual BIOS by build option)
    • Intel i226 2.5GbE controller
  • 2x 220-pin connectors with:
    • Storage: 2x SATA III 6 Gbps
    • Networking:
      • 2x 10GBASE-KR and its sideband signals
      • 1x 2.5GbE interface
    • USB: 4x USB 3.x/2.0/1.1
    • Expansion buses:
      • 8x PCI Express Gen4: Lanes 16-23 (configurable to one x8, two x4, two controller)
      • 4x PCI Express Gen4: Lanes 0-3 (configurable to four x1, two x2, one x4, four controller)
      • 2x PCI Express Gen4: Lanes 4-5 (configurable to one x1, one x2, one controller)
      • LPC bus (through an ESPI to LPC bridge IC), SMBus (system), I2C (user), GP_SPU (user, project basis)
    • Serial: 2x UART ports with console redirection
    • IOs: 4x GPO and 4x GPI (with interrupt)
  • SEMA Board Controller: Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (dual BIOS by build option)
  • Optional IPMB (in conjunction with carrier BMC for remote management Controller applications) by build option
  • Super I/O: Supported on carrier if needed (standard support for W83627DHG-P, other Super I/O supported on request)
  • Debug Headers: 40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs
  • Security: Infineon TPM 2.0 (SPI based)
  • Power Management:
    • Standard Input: ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
    • ACPI 5.0 compliant
    • Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
  • Dimensions: 125 x 95 mm (PICMG COM.0: Rev 3.1 Type 7 Basic size)
  • Temperature Range:
    • Operating: Standard: 0°C to 60°C; Extreme Rugged: -45°C to 85°C (build option, selected SKUs)
    • Storage: Standard: -20°C to 80°C; Extreme Rugged: -40°C to 85°C
  • Humidity:
    • 5-90% RH operating, non-condensing
    • 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration:
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
  • HALT: Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

ADLINK provides standard support for Yocto Linux and Ubuntu 20.04.3 LTS, as well as extended support for Yocto Project-based Linux. The company plans to offer I-Pi development kits based on the Express-VR7 module for easy prototyping and evaluation.

The availability of the Express-VR7 COM Express module based on the AMD Ryzen Embedded V3000 SoC has not been confirmed at this time. Additional details can be found on the product page.

Source: CNX Software – Embedded Systems News.