PICMG has announced the release of the COM-HPC 1.2 specification, which includes the new COM-HPC Mini form factor. This form factor, about the size of a credit card at 90x75mm, provides access to high-speed interfaces such as PCIe Gen5, USB4, and 10GbE.
The COM-HPC Mini form factor is a smaller version of the COM-HPC standard, designed for applications like autonomous mobile robots, drones, and mobile 5G test and measurement equipment. It offers a compact solution for edge computing.
The COM-HPC 1.2 “Mini” modules come with a single 400-pin connector and various interfaces, including storage with 2x SATA ports (shared with PCIe lanes), display with 1x eDP and 2x DDI, networking with 2x 10 Gbps NBASE-T Ethernet ports, USB with 8x SuperSpeed lanes for USB4/ThunderBolt or USB 3.2, 8x USB 2.0, PCIe with 16x PCIe lanes supporting PCIe 4.0 or PCIe 5.0, and miscellaneous features such as boot SPI and eSPI, UART, CAN, Audio, FUSA, and power management signals.
The COM-HPC Mini modules support cameras via an FFC connector with a MIPI CSI interface. The input voltage ranges from 8V to 20V DC, and the modules can handle up to 107W of input power. The dimensions of the modules are 95 x 70 x 15 mm.
While the COM-HPC 1.2 specification has been released and is available for download, it comes at a cost of 750 Euros. The information provided above is based on a press release, as access to the specification is required to obtain further details.
It is unclear when companies like congatec or ADLINK will release actual COM-HPC Mini modules. However, PICMG plans to release a “COM-HPC 1.2 Carrier Design Guide” in early 2024, suggesting that announcements may be expected later in the first half of 2024.
Source: CNX Software – Embedded Systems News.